Accompanying the increase in speed
and the decrease in size of electronic
components is the significant power
density increase that must not be
neglected. This leads to power
dissipation issues, which can have a
significant impact on chip or
component life span and even the
system stability if not handled

In response to the increasingly critical
thermal issues, the "PC AirCon
Cooling " was especially developped,
which is a global solution to provide
extra cooling to all the components
inside the system. It is considered as
System Level cooling, where the
cooling effect is throughout the case,
not targeted at specific chips or


Most conventional Component Level thermal solutions cool the targeted chips or components by using the air within the case and then release the now hotter air within the case. The waste heat built-up within the case causes the system temperature to rise and thus puts a heavy burden on the exhaust fan. The PC AirCon Cooling system resolves the thermal issue in a different way. It delivers chilled air into the case, thus causing the chips and components within to be immersed in a cooler environment. Under such circumstance the temperature of all chips and components is lowered and the workload for the exhaust fan is reduced.

With the considerable amounts of heat generated by internal components, better cooling support on the System Level, "PC AirCon Cooling" will not only benefit the system, but also help the component level coolers.

These are just the Value & Potentiality of our "PC Air-Con Cooling" for the future PC Systems.


Nextherm PC AirCon Cooling, PC Air-Conditioning Cooling, is a global cooling solution, which provides extra cooling power to all the components inside the system.

This extra cooling power is achieved using the Thermoelectric Technology, by harvesting the cooling capacity of a thermoelectric chip. The main structure of the PC Air-Conditioning Cooling System consists of a thermoelectric chip and two heatsink-fan modules on each side of the thermoelectric chip.

Fresh air from outside the case at the ambient temperature is blown through the fan onto the heatsink on the “Hot Side” of the thermoelectric chip, to dissipate the heat generated by the thermoelectric chip. Meanwhile, on the “Cold Side” of the thermoelectric Chip, fresh air from outside the case is pumped through the low temperature heatsink and then sent into the PC system.

Via the mechanisms of convection, the temperature of the fresh air passing through the low temperature heatsink is reduced to below the ambient level. Therefore the temperature of the air entering the PC system is lower than the ambient temperature.

In layman's terms, PC AirCon Cooling System is like an Air Conditioner for a PC System.


The “PC AirCon Cooling" is considered as "System Level Cooling", where the cooling effect is throughout the case, not targeted at specific chips or components. Thus, the meaning of "a one degree of temp. decrease by PC AirCon Cooling" inside the system is totally different from the other coolers ("Component Level") do.

Different from the other traditional cooelrs which are only for the individual components, every one degree that the "PC AirCon Cooling" pulls down is not simply just a one, but by "MULTIPLE", which means a one degree of heat respectively from the motherboard, from the CPU, from the VGA card, from the chipsets, and etc OVERALL are taken away.

The definition of a one degree cooling by PC AirCon PAC 400 inside the system is => 1 degree of heat of "the motherboard" ( ? Watts) + the CPU (? Watts) + the VGA card ( ? Watts) + the Chipsets ( ? Watts) + Other electric components inside the PC system ( ? Watts) .

It is a "Multi-One" Degree, not a single one degree.

The cooling power for this air temperature drop is expressed as:

Q=(m) x (Cp) x (dT)


(Q) is cooling power in KJ (joule)
(m) is the amount of air measured in weight (Kg)
(Cp) is 1.007 KJ/(KgK) for air at 298K (25C)
(dT) is the inside/outside air temperature difference